Challenges when dealing with high-power-density designs. Utilizing cloud manufacturing platforms (CMPs). Power packaging using additive manufacturing. Today’s designers are now more equipped to ...
Brazilian Journal of Probability and Statistics, Vol. 32, No. 4 (2018), pp. 834-850 (17 pages) Chaubey, Y. P., Chesneau, C. and Doosti, H. (2011). On linear wavelet ...
Fine powders and granular materials are commonly utilized in industrial applications. These materials must be characterized with precision to optimize and control processing techniques. The ...
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