The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
5G chipmakers have placed a lot of attention on supporting new 5G technologies, including 5G-Advanced, satellite non-terrestrial network (NTN) connectivity, 5G fixed wireless access (FWA), and 5G Open ...
Infineon Technologies AG has released the next generation of high-density power modules, supporting AI and high-performance data-center compute. Data centers represent two percent of global energy ...
A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure, cooling systems, and power grids to breaking point. The next generation ...
Why is AI so power-hungry? Vertical vs. lateral power delivery. Details on the Infineon-Delta VPD solution. Infineon expanded its existing collaboration with Delta Electronics to develop ...
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
xMEMS Labs has turned its silicon-based micro speakers into something cool. The xMEMS XMC-2400 µCooling chip is an active micro-cooling fan that fits in places where a conventional cooling fan is too ...
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