Packaging and thermal design are driven by increased power density and the many trade-offs in power topology selection. Paul Greenland, National Semiconductor Corp., Santa Clara, Calif. The world of ...

The power-semiconductor industry is experiencing growth exceeding 7% per year, driven by new applications such as electric cars and new technologies like silicon-carbide (SiC) and gallium-nitride ...

Digital twins dominated discussions at SEMICON West this year, appearing in keynote presentations, panel sessions, and workshops. The conversation reflected a noticeable shift in how the industry ...

Packaging has always been a balancing act. Consumer packaged goods (CPG) companies must weigh cost versus performance and market appeal versus machinability. As interest in sustainable packaging has ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.