The term "multiphysics" applied to FEA software refers to the simultaneous combination of multiple physical models from different domains — such as fluid, structure, and chemical — to accurately ...

ANSYS Inc ANSS recently expanded its long-standing collaboration with TSMC to transform the semiconductor industry by leveraging artificial intelligence (AI) to advance multiphysics solutions to ...

The stress-from-heat problem involves a tube in a ceramic block. One surface of the block is uniformly heated. A first step of this sequential multiphysics analysis solves for the velocity profile.

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...

COMSOL, the leading provider of software solutions for multiphysics modelling and simulation, today made available the latest release of the COMSOL Multiphysics and COMSOL Server products. Version ...

Attendees of the COMSOL Conference in Boston this week were treated to a sneak preview future developments of the popular multiphysics software from Svante Littmarck, President and CEO of COMSOL. The ...

In this Let’s Talk Exascale Podcast, Stuart Slattery and Damien Lebrun-Grandie from ORNL describe how they are readying algorithms for next-generation supercomputers at the Department of Energy. The ...