Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure Wafer XRD 200 stands as an ultra-fast ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

One of the main challenges in developing semiconductor chip technology is making electronic components smaller and more effective. This difficulty is most noticeable in lithography, which is the ...

NexWafe’s high-throughput epitaxy tool, ProCon 2.5. Image: NexWafe German solar wafer manufacturer NexWafe has announced “key milestones” in its epitaxial wafer production which it claims can reshape ...